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Adhesive contacts which possess a dominant stress concentration, such as at the contact edge in spherical junctions or at the detachment front in a peeling film, are well studied. More complex adhesive junction geometries, such as mushroom-shaped fibrils in bioinspired micropatterned dry adhesives, have exhibited a complex dependence of adhesive strength on the presence of interfacial defects within the contact. This has led to the emergence of statistical variation of the local behavior among micropatterned sub-contacts. In order to examine the interplay between geometry and interfacial defect character in control of the adhesive strength, the model system of a stiff cylindrical probe on an elastic layer is examined. Both experiments (glass on PDMS) and cohesive zone finite element simulations are performed, with analytical asymptotic limits also considered. The thickness of the elastic layer is varied to alter the interfacial stress distribution, with thinner layers having a reduced edge stress concentration at the expense of increased stress at the contact center. The size and position of manufactured interfacial defects is varied. It is observed that for the thickest substrates the edge stress concentration is dominant, with detachment propagating from this region regardless of the presence of an interfacial defect within the contact. Only very large center defects, with radius greater than half of that of the contact influence the adhesive strength. This transition is in agreement with analytical asymptotic limits. As the substrate is made thinner and the stress distribution changes, a strong decay in adhesive strength with increasing center defect radius emerges. For the thinnest substrate the flaw-insensitive upper bound is approached, suggesting that this decay is dominated by a reduction in the contact area. For penny-shaped defects at increasing radial positions, the adhesive strength for the thinnest substrates becomes non-monotonic. This confirms an intricate interplay between the geometry-controlled interfacial stress distribution and the size and position of interfacial defects in adhesive contacts, which will lead to statistical variation in strength when defects form due to surface roughness, fabrication imperfections, or contaminant particles. 

Adhesive contacts which possess a dominant stress concentration, such as at the contact edge in spherical junctions or at the detachment front in a peeling film, are well studied. More complex adhesive junction geometries, such as mushroom-shaped fibrils in bioinspired micropatterned dry adhesives, have exhibited a complex dependence of adhesive strength on the presence of interfacial defects within the contact. This has led to the emergence of statistical variation of the local behavior among micropatterned sub-contacts. In order to examine the interplay between geometry and interfacial defect character in control of the adhesive strength, the model system of a stiff cylindrical probe on an elastic layer is examined. Both experiments (glass on PDMS) and cohesive zone finite element simulations are performed, with analytical asymptotic limits also considered. The thickness of the elastic layer is varied to alter the interfacial stress distribution, with thinner layers having a reduced edge stress concentration at the expense of increased stress at the contact center. The size and position of manufactured interfacial defects is varied. It is observed that for the thickest substrates the edge stress concentration is dominant, with detachment propagating from this region regardless of the presence of an interfacial defect within the contact. Only very large center defects, with radius greater than half of that of the contact influence the adhesive strength. This transition is in agreement with analytical asymptotic limits. As the substrate is made thinner and the stress distribution changes, a strong decay in adhesive strength with increasing center defect radius emerges. For the thinnest substrate the flaw-insensitive upper bound is approached, suggesting that this decay is dominated by a reduction in the contact area. For penny-shaped defects at increasing radial positions, the adhesive strength for the thinnest substrates becomes non-monotonic. This confirms an intricate interplay between the geometry-controlled interfacial stress distribution and the size and position of interfacial defects in adhesive contacts, which will lead to statistical variation in strength when defects form due to surface roughness, fabrication imperfections, or contaminant particles. 

Abstract Experimental evidence suggests that suction may play a role in the attachment strength of mushroom-tipped adhesive structures, but the system parameters which control this effect are not well established. A fracture mechanics-based model is introduced to determine the critical stress for defect propagation at the interface in the presence of trapped air. These results are compared with an experimental investigation of millimeter-scale elastomeric structures. These structures are found to exhibit a greater increase in strength due to suction than is typical in the literature, as they have a large tip diameter relative to the stalk. The model additionally provides insight into differences in expected behavior across the design space of mushroom-shaped structures. For example, the model reveals that the suction contribution is length-scale dependent. It is enhanced for larger structures due to increased volume change, and thus the attainment of lower pressures, inside of the defect. This scaling effect is shown to be less pronounced if the tip is made wider relative to the stalk. An asymptotic result is also provided in the limit that the defect is far outside of the stalk, showing that the critical stress is lower by a factor of 1/2 than the result often used in the literature to estimate the effect of suction. This discrepancy arises as the latter considers only the balance of remote stress and pressure inside the defect and neglects the influence of compressive tractions outside of the defect.